What is qfn package

The flip-chip technique offers better electrical performance compared to the conventional one. The metalized terminal pads are located at the bottom surface. These terminal pads are present along the four edges of the bottom surface and provide electrical interconnections to the PCB.

The bottom side of the package consists of an exposed pad. This pad provides an efficient heat path to the PCB. The exposed pad enables ground connection as well.

The QFN package is soldered to the circuit board at the exposed pad. The die attach is the epoxy material used to fix the die to the exposed pad. The following are some of the properties of standard QFN packages:. Based on the method of molding, the QFN packages are classified into punch-type and sawn-type packages. In punch-type singulation, the package is molded in the single mold cavity format and is separated using a punch tool.

This means that only a single package is molded into shape using this method. These packages are molded using the mold array process MAP. This method involves cutting a large set of packages into parts. A final saw process helps to separate the sawn-type packages into individual packages.

The terminal pads of the QFN can be different from each other on the basis of their design, shape, and dimensions. Given below are the different types of terminal pads available. Fully exposed terminal ends of QFN. Image credit: NXP Semiconductors. In this type, the terminal ends are fully exposed all the way to the edge of the package and to the side of the package. Pull-back terminal ends of QFN. The terminal ends are pulled back from the edges of the package.

Solder fillets are not added after the reflow soldering process for this type of terminal end packages. These types of terminal ends are an altered form of fully exposed terminal ends. Side wettable flank terminal ends enable solder wetting for the formation of solder fillets. Table 1. Part Number No.

Top and bottom views of a QFN package. See more IC Package Types. Body Size. We believe that when engineers have trusted content and design data at their fingertips, that they can be free to innovate and create the amazing products that improve our world.

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Learn more at www. December 22, Viktorrine Ira. It is also inexpensive to manufacture PCBs with QFN packages since the assembly requires lesser time and materials for mounting Cons: Soldering — There is a higher risk of solder-bridging due to its narrow pad-to-pad pitch. Author Details. Viktorrine Ira Editor. Computer Engineer. Leave a comment Cancel Reply Your email address will not be published.

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